CMF Technology

Cold Metal Fusion (CMF)

CMF-Technology schematic illustration

Cold Metal Fusion (CMF) is a sinter-based additive manufacturing process similar to Selective Laser Melting (SLM). The feedstock (a mixture of metal powder and binder) is applied layer by layer to a platform and irradiated at specific points by lasers so that the binder hardens at the corresponding points. Layer by layer, the green part is created in this way in the building space. In contrast to the SLM process, less energy and time are required because the binder hardens at lower temperatures than the metal powder itself. After cleaning and pre-debinding of the green parts, they can be taken to the sintering process.

Characteristic features

  • particularly suitable for components > 5cm
  • high printing speeds
  • easy post-processing due to high green part strength
  • wide variety of materials

Technical properties

  • Surface: Ra ~ 17 µm
  • Tolerances: ±0.1 mm
  • Layer thickness: 70-120 µm